RFMW announced design and sales support for a high linearity, low-threshold, dual PIN limiter diode module, the Skyworks SKY16603-632LF.
Passive Plus, Inc.’s (PPI) brand new online Capacitor Application Program (C.A.P.) helps engineers and designers select capacitors according to parameters such as cap value and frequency.
Beep, a Florida-based autonomous mobility-as-a-service (MaaS) provider, announced they will deploy the first autonomous shuttles at Yellowstone National Park with the National Parks Service (NPS) in May 2021.
The GSA announces jointly with COAI and GSMA the importance of mmWaves for India’s 5G future.
Ampleon announced the BLU9H0408L-800P 800 W RF power transistor. Using Ampleon’s latest Gen9 (50 V) LDMOS process technology, the BLU9H0408L-800P has been specifically designed for use in high power radar systems operating in the 400 MHz to 800 MHz UHF frequency band.
The LoRa Alliance®, the global association of companies backing the open LoRaWAN® standard for internet of things (IoT) low-power wide-area networks (LPWANs), announced that it published the LoRaWAN TS1-1.0.4 Link Layer (L2) Specification.
Viavi Solutions Inc. announced the company successfully participated in a global O-RAN plugfest hosted by several Tier-1 communications service providers and the O-RAN ALLIANCE.
OnScale announced the release of the OnScale Solve, the web-based cloud engineering simulation platform bringing to engineers powerful multiphysics solvers and scalable cloud supercomputer resources.
BT and EE customers are set to benefit from Ericsson 5G Radio Access Network (RAN) connectivity following the company’s selection as BT’s 5G RAN provider in the U.K. capitals London, Edinburgh, Belfast and Cardiff and other major cities.
The newly re-elected leaders of the Wireless Broadband Alliance (WBA) believe the world is on the verge of becoming one giant global Wi-Fi network, and will outline a powerful and ambitious vision for the future of Wi-Fi at the Alliance’s 37th annual Wireless Global Congress, October 28th.
Akoustis Technologies, Inc. announced that it has been awarded a new, multi-year direct-to-phase 2 (DP2) contract from DARPA to further develop Akoustis’ technology through the development of a Piezo MEMS process design kit (PDK) for the company’s proprietary and patented XBAW™ process.