Skynopy announced that it has been selected as a winner of the Private Sector Study and Aid Fund (FASEP) – Digital Infrastructures program, a financing scheme of the French Ministry of Economy, Finance and Industrial and Digital Sovereignty (Bercy), for the SkyConnect Kenya project, carried out in collaboration with Safran Space.
Taara announced a breakthrough approach to commercial communications and connectivity infrastructure, unveiling Taara Photonics, the world’s first wireless communication platform based on optical phased arrays, along with Taara Beam, its first product based on this photonic core.
Yole Group announced the release of its annual market and technology report, "Status of the Compound Semiconductor Industry 2026 – Focus on Substrates and Epiwafers," highlighting sustained structural growth through 2031.
Teledyne SP Devices’ ADQ35 offers a combination of speed, resolution and flexibility for demanding scientific, industrial and OEM applications.
Socionext and Innatera announced a jointly developed human-presence detection solution that combines 60 GHz FMCW radar sensing with neuromorphic edge AI to deliver reliable, always-on detection with drastically reduced power consumption.
Rohde & Schwarz, in collaboration with Broadcom, will display its CMX500 multi-technology multi-channel signaling tester at MWC Barcelona 2026 with newly added Wi-Fi 8 (IEEE 802.11bn) testing capabilities.
The Wireless Broadband Alliance (WBA) announced its new report, AI/ML for Wi-Fi: Enabling Scalable, Intelligent Wi-Fi Ecosystems.
Keysight Technologies, Inc. launched its next-generation Infiniium XR8 Real-Time oscilloscopes, designed to accelerate high speed digital and compliance testing while improving efficiency and insight for modern electronics development.
Teledyne HiRel Semiconductors announced the TDLNA0840EP, an ultra-low-power, wideband, low-noise amplifier (LNA) that delivers guaranteed operation to 4.0 GHz, while consuming only tens of milliwatts from a single 1.5 V supply.
Small form factor devices often fail traditional field‑induced CDM testing, prompting the need for contact‑first methods. This article compares CC‑TLP, low‑impedance contact CDM, and relay‑based CDM techniques, outlining how each provides more repeatable, lower‑noise stress conditions for bare die and wafer‑level testing.
The post Small Form Factor CDM Testing, Part 3 appeared first on In Compliance Magazine.
Conducted emissions testing on custom PCBs shows how moving a decoupling capacitor farther from an IC can increase emissions across multiple frequency bands. Using CISPR 25 methods, this study compares capacitor placements and via topologies to reveal how distance and inductance shape PDN behavior.
The post Impact of PCB Via and Trace Geometry on the Effectiveness of Decoupling Capacitors, Part 2 appeared first on In Compliance Magazine.
Z-Communications, Inc. announced the launch of the CRO6000X2-LF C-Band oscillator.