The IEEE Electronic Components and Technology Conference (ECTC) has extended the deadline for the Student Innovation Challenge for ECTC 2026.
YINCAE Advanced Materials will showcase its latest wafer-level packaging solutions at the Wafer-Level Packaging Symposium, taking place February 17–19, 2026, in San Francisco, Calif., USA.
The Z-Wave Alliance announced the continued expansion of Z-Wave Long Range (ZWLR) certification across the ecosystem.
Sony Semiconductor Israel (Sony) announced its long-term vision for 5G IoT connectivity, positioning eRedCap (enhanced Reduced Capability) as the foundation for the next generation of global, long-life connected Altair devices.