Using a combination of two TDD carrier component aggregation with C-Band spectrum and uplink MIMO technology, Verizon, Ericsson and Qualcomm Technologies, Inc. achieved a U.S. record-breaking 480 Mbps uplink speed using sub-6 GHz spectrum
Vishay Intertechnology, Inc. introduced a new series of surface-mount multilayer ceramic chip capacitors (MLCCs) for high voltage commercial applications.
Indium Corporation is set to introduce its newest Heat-Spring® pattern — HSx, at TestConX 2025, taking place March 3-5 in Mesa, Ariz.
NASA’s quiet supersonic X-59 research aircraft has cleared electromagnetic testing, confirming its systems will work together safely, without interference across a range of scenarios.
Rohde & Schwarz has developed an innovative approach to automate test script generation and functional testing with the new CMX500 AI Scripting Assistant.
u-blox and Rohde & Schwarz have successfully validated u-blox’s latest automotive GNSS module in accordance with the recently published Chinese GB/T test requirement for automotive on-board GNSS positioning systems.
The IEEE has partnered with a major testing and standards development organization to create a new standard to address the securing of biomedical devices and health-related data.
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