Microwave Journal Magazine

Samtec, Inc has achieved Cybersecurity Maturity Model Certification (CMMC) Level 2 certification. 

Richardson Electronics will partner with Nxbeam to supply customers with a range of high-power microwave MMICs, with frequencies ranging from 12.5 to 76 GHz and output power up to 46 dBm.

SatService GmbH has been awarded a contract by the Federal Ministry of Defence of Germany to deliver an advanced, full-service Q/V-Band satellite ground station in support of scientific and modern military satcom.

Pickering Interfaces will showcase its sensor simulation for HIL engine demo on stand A46 at the upcoming Space-Comm Expo Europe 2026, which takes place March 4-5 at Excel London, U.K. 

BAE Systems has received Foreign Military Sales contracts from the U.S. Army valued at $137 million to deliver its AN/AAR-57 Common Missile Warning Systems (CMWS) to allied nations.

Good news for prospective authors at the 2026 WAMICON! The Call for Papers deadline has been extended to February 20, 2026, due to demand and the latest program updates.

According to a recently published report by Dell’Oro Group, Open RAN has come a long way since the Open RAN Alliance was formed back in 2018. But the results have been mixed, and the vision and expectations have evolved.

Taoglas® announced the launch of the world's first AI-driven Antenna Product Recommendation Engine, a groundbreaking platform set to revolutionize how engineers and organizations select antennas and RF components.

STI-CO Industries, LLC announced the expansion of its RF, power and data cable assembly, wire harness and over-molding capabilities, supporting higher frequency, ruggedized designs for defense and industrial platforms operating in harsh environments.

EnSilica plc will exhibit at MWC Barcelona 2026 from March 2 - 5 in Hall 7, Stand 7B17.

According to Yole Group’s latest report on the RF GaN market, GaN devices play a critical role in high-power RF signal generation and amplification, with growing adoption across telecom infrastructure, defense and satellite communications. 

SiTime Corporation and Renesas Electronics Corporation announced that SiTime and Renesas’ consolidated subsidiary, Renesas Electronics America Inc., have signed a definitive agreement whereby SiTime will acquire certain assets related to Renesas’ timing business. 

The Next Generation Mobile Networks Alliance (NGMN) announced new guidance designed to help mobile network operators (MNOs) simplify 5G network operations, to reduce total cost of ownership, cut operational complexity and achieve sustainability goals, ultimately enabling more reliable, efficient and innovative services for the benefit of customers.

bitsensing launched ADAS Kit, an advanced driver assistance systems (ADAS) solution designed to greatly improve safety and driving awareness in existing commercial vehicles, by providing an extensive range of driver warnings during vehicle operations.  

Rohde & Schwarz invites attendees to Mobile World Congress 2026 in Barcelona to stop by the company’s booth to connect with its experts and to explore solutions for the next generation of wireless technologies. 

VIAVI Solutions Inc. announced enhancements to its XEdge cloud-based edge monitoring and assurance platform with new sensors that strengthen data collection capabilities for private 4G, 5G and Wi-Fi networks at the edge.

Signal Hound the release of the VSG200, a 20 GHz vector signal generator (VSG) offering 40 MHz of real-time streaming bandwidth.

Texas Instruments and Silicon Labs announced they have signed a definitive agreement under which Texas Instruments will acquire Silicon Labs for $231.00 per share in an all-cash transaction, representing a total enterprise value of approximately $7.5 billion.

Building on its award-winning portable AI-sensing radar for counter-UAS, MatrixSpace announces a major update to its edge-to-cloud MatrixSpace AI Software Platform.

Siemens announced the acquisition of Canopus AI, an innovator in computational and AI-driven metrology solutions, enabling semiconductor manufacturers to achieve new levels of precision and efficiency in wafer and mask inspection processes.