17 hours 1 minute ago
KYOCERA AVX is exhibiting at IMS2026, also known as the IEEE International Microwave Theory Symposia, which is taking place this week — Sunday, June 7, through Friday, June 12 — in Boston.
18 hours 49 minutes ago
CML Micro will highlight its expanding RF, defence & aerospace and satellite technology portfolio at the IEEE MTT-S International Microwave Symposium (IMS) 2026.
3 days 19 hours ago
Hansjörg Herrbold and Andreas Hägele will take over as Executive Vice Presidents Technology Systems at Rohde & Schwarz.
4 days 18 hours ago
Junkosha announced that its third Technology Innovator of the Year Award ceremony will take place on June 17, 2026, at 11:00 am ET/ 8:00 am PT via Junkosha’s livestream on YouTube.
4 days 19 hours ago
Infinite Orbits and Open Cosmos have announced their partnership on a new Infinite Orbits’ LEO mission designed to advance autonomous inspection and operational SSA capabilities.
4 days 19 hours ago
Emerson announced the latest additions to its NI PXI Vector Signal Transceiver (VST) portfolio designed to expand access to high performance RF test technologies in cost-sensitive applications, including medical device development and electronic validation and production environments.
5 days 11 hours ago
Signal Hound announced a new licensed Spike™ software measurement tool kit that adds comprehensive pulse and radar signal analysis for both commercial and defense applications.
5 days 13 hours ago
Qorvo® announced a new portfolio of silicon-on-insulator (SOI) RF switches and digital step attenuators designed for defense, aerospace and infrastructure customers.
5 days 17 hours ago
Taoglas will showcase AI technologies and engineering tools designed to simplify wireless product development at Hardware Pioneers Max 2026.
5 days 19 hours ago
At its booth 23045 in Hall A, Aaronia AG will showcase the latest innovations in high-frequency measurement technology, featuring state-of-the-art test and measurement equipment and accessories, to the more than 8,000 expected visitors from over 55 countries.
6 days 13 hours ago
Keysight Technologies, Inc. introduced the Pro XA6 SA6320A and Expert XA5 SA6210A signal analyzers, designed to help engineers design and validate increasingly complex wireless systems faster and with greater confidence.
6 days 15 hours ago
The 2026 IEEE International MTT Symposia (IMS2026) announced its Technical Program and Plenary Speakers for the annual gathering of RF and microwave engineers, set for 7-12 June 2026, at the Thomas M. Menino Convention and Exhibition Center (MCEC) in Boston.
6 days 15 hours ago
Microwave Techniques
announced it has entered into a definitive license agreement with Brookhaven Science Associates (BSA), operator of Brookhaven National Laboratory (BNL), for the ARC Sentry arc detector technology.
6 days 15 hours ago
IMS Boston attendees looking to stay abreast of the latest in RF cable assembly technology can meet with the ConductRF team at Booth #16095 and explore their unique capability to deliver rapidly tailored flexible, semi-flexible, handformable and semi-rigid RF cable assembly solutions.
6 days 18 hours ago
Integra Technologies, Inc. announced it will be exhibiting at the IEEE MTT-S International Microwave Symposium (IMS2026).
6 days 19 hours ago
Rohde & Schwarz has supplied the independent test house BTL Laboratory in Taiwan with a full R&S TS8991 OTA test system that meets CTIA Certification standards.
1 week ago
42 Technology (42T) has played a central role in helping Omnisense, a company specialising in terrestrial positioning technology, to demonstrate a safer autonomous drone landing system when satellite navigation signals are unreliable.
1 week ago
Keysight Technologies, Inc. is collaborating with NTT DOCOMO, Inc. and NTT, Inc. to accelerate realistic 6G channel modeling and wireless communication simulation.
1 week ago
Indium Corporation® will highlight its high-reliability, gold-based precision die-attach preforms at the International Microwave Symposium (IMS), June 7-12, in Boston, Mass.
1 week 3 days ago
CEA-Leti announced a major milestone in the evolution of 3D integration for HPC, advanced smart-vision systems and AI, demonstrating a functional test vehicle utilizing D2W hybrid bonding with pitches down to 1 μm. The findings were presented at the ECTC 2026.
Checked
11 hours 53 minutes ago
RSS feed for Microwave Journal Industry News section
Subscribe to Microwave Journal Magazine feed