EMV 2027: Strong Early Bookings, International Demand and a Future-Focused Program
Just over six months before the event begins, there is already high demand for exhibition space at the EMV 2027.
Microwave Journal Magazine
Microchip Achieves Key Program Milestones for its PIC64-HPSC Spaceflight Computing Series
As civil, commercial, scientific and defense spacecraft become more autonomous, software-defined and data intensive, mission developers need substantially greater onboard processing capability, combined with the resilience, security and reliability required for demanding space environments.
KRYTAR Announces New Directional Coupler Covers 1.0 to 12.4 GHz with 20 dB Coupling
KRYTAR, Inc. announces a new Directional Coupler covering the frequency range from 1.0 to 12.4 GHz with Nominal Coupling of 20 dB.
Samtec to Exhibit Defense, Aerospace and Robotics Solutions at electronica 2026
Samtec, Inc. will present its full line of interconnect products, including solutions for the defense, aerospace and robotics industries, in Hall B2, Booth 107 at electronica 2026 (10 to 13 November 2026, Trade Fair Center Messe Munich, Germany).
Movandi Unveils 60GHz Multi-Gigabit Connectivity Platform for Physical AI and Wireless Infrastructure
Movandi announced its new 60GHz connectivity platform, powered by the MV6055 60GHz transceiver, to address the growing bandwidth and latency requirements across multiple markets.
Rohde & Schwarz at electronica 2026: From Everyday Bench Work to Extraordinary Test Applications
At electronica 2026 in Munich, Rohde & Schwarz will present its state-of-the-art test and measurement solutions covering the full range from everyday lab work to demanding applications that call for new measurement approaches.
IMS Displays High Performance Passive Component Solutions at 2026 Electronica
International Manufacturing Services, Inc. (IMS) will be highlighting some of its latest high performance passive component solutions at the upcoming 2026 Electronica exhibition in Munich, Germany.
AI Accelerator Chips Market to Cross USD 1 Trillion by 2035
The global AI accelerator chips market was valued at USD 120.2 billion in 2025 and is estimated to grow at a CAGR of 23.6 percent to reach USD 1 trillion by 2035, according to recent report by Global Market Insights Inc.
Aaronia Reports Positive Results from EuMW 2026 in London – SPARK Controls Qubits Focus on New Power Meters Up to 1.1 THz and Customizable Rugged Tablets
Aaronia AG showcased new power meters for frequencies up to 1.1 THz, high performance real-time spectrum analyzers, and customizable rugged tablets at the European Microwave Week (EuMW) 2026 in London.
Ulrich L. Rohde Appointed TUM Distinguished Affiliated Professor and Awarded the Bene Merenti Medal in Gold
In recognition of his many years of outstanding achievements in science and technology, Ulrich L. Rohde was named a TUM Distinguished Affiliated Professor and awarded the Bene Merenti Prize in Gold.
Siemens and NVIDIA Advance AI-Powered PCB Inspection from Digital Twin to Factor
Siemens announced a new collaboration with NVIDIA to develop adaptive AI-powered manufacturing capabilities that combine industrial software, Siemens’ Digital Twin technology and NVIDIA Cosmos to accelerate production planning, inspection preparation and optimization.
PHY Wireless and Ubiik Deliver a 3GPP Standards-Based Alternative for Physical AI and Industrial Positioning
PHY Wireless and Ubiik, a leading provider of private LTE and 5G networking solutions, announced a strategic collaboration to deliver an integrated communications and positioning platform designed for enterprise, industrial, utility, healthcare and campus environments.
Guerrilla RF Expands GaN Design Support and Begins Sampling New High-Power Devices
Guerrilla RF, Inc. (OTCQX: GUER) announced that new nonlinear simulation models for its GRF0005 and GRF0012 gallium nitride (GaN) power transistors are now available in the Modelithics COMPLETE Library™.
Anywaves Appoints Former Luxembourg Space Agency CEO Marc Serres as Chief Business & Growth Officer
Anywaves strengthens its Executive Committee with the appointment of Marc Serres, former CEO of the Luxembourg Space Agency (LSA), as Chief Business & Growth Officer.
LeapWave Technologies Wins KES 2026 Innovation Award for Sub-THz Interconnects
Deep-tech pioneer LeapWave Technologies has been awarded the 15th KES Innovation Award in Electronic Components & Materials category at KES 2026 in Seoul for its TX500/RX500 sub-terahertz modules and LW C500 IC interface.
Five New High Performance MMIC Products from ATEK MIDAS
ATEK MIDAS is excited to announce five new MMIC products, in stock and available now for your critical design-ins.
Teledyne Storm Microwave and Omnetics Introduce MultiFlex Micro-D™ RF Interconnect Solution
Teledyne Storm Microwave, part of Teledyne Technologies Incorporated, announced the introduction of the MultiFlex Micro-D™, a high performance RF interconnect solution developed through a partnership between Teledyne Storm Microwave and Omnetics Connector Corporation.
Keysight Expands Active and Passive 1.6T Copper Interconnect Validation for Scale-Out Data Centers
Keysight Technologies, Inc. (NYSE: KEYS) announced the Functional Interconnect Test Solutions (FITS)-16CH digital-layer error performance validation system, expanding Keysight’s FITS portfolio for optical, active copper and passive copper interconnects.
Vantron's VT-MOB-AH-8108 Wi-Fi HaLow Module, Built on Morse Micro's MM8108, Achieves CE/FCC/UL Certification
Morse Micro, the global technology leader in Wi-Fi HaLow, announced that Vantron’s VT-MOB-AH-8108 Wi-Fi HaLow Module has achieved CE, FCC and UL certification.
EnSilica to Showcase Custom ASIC Design and Supply at electronica 2026
EnSilica will showcase its custom silicon design and supply capabilities at electronica 2026, taking place in Munich from 10 to 13 November.
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