Small form factor devices often fail traditional field‑induced CDM testing, prompting the need for contact‑first methods. This article compares CC‑TLP, low‑impedance contact CDM, and relay‑based CDM techniques, outlining how each provides more repeatable, lower‑noise stress conditions for bare die and wafer‑level testing.
The post Small Form Factor CDM Testing, Part 3 appeared first on In Compliance Magazine.
Keysight Technologies, Inc. launched its next-generation Infiniium XR8 Real-Time oscilloscopes, designed to accelerate high speed digital and compliance testing while improving efficiency and insight for modern electronics development.
Teledyne HiRel Semiconductors announced the TDLNA0840EP, an ultra-low-power, wideband, low-noise amplifier (LNA) that delivers guaranteed operation to 4.0 GHz, while consuming only tens of milliwatts from a single 1.5 V supply.
The Wireless Broadband Alliance (WBA) announced its new report, AI/ML for Wi-Fi: Enabling Scalable, Intelligent Wi-Fi Ecosystems.
Conducted emissions testing on custom PCBs shows how moving a decoupling capacitor farther from an IC can increase emissions across multiple frequency bands. Using CISPR 25 methods, this study compares capacitor placements and via topologies to reveal how distance and inductance shape PDN behavior.
The post Impact of PCB Via and Trace Geometry on the Effectiveness of Decoupling Capacitors, Part 2 appeared first on In Compliance Magazine.
Z-Communications, Inc. announced the launch of the CRO6000X2-LF C-Band oscillator.