Taoglas® announced the expansion of its embedded antenna portfolio with a new range of low temperature co-fired ceramic (LTCC) chip antennas optimized for Wi-Fi® 6/7, ultra-wideband (UWB) and ISM connectivity.
Anywaves announced the creation of a new U.S.-based subsidiary, Anywaves Federal, focused on government and defense customers.
According to a recently published report from Dell’Oro Group, total global revenue for the broadband access equipment market decreased to $4.5 billion in 3Q 2025, down 3 percent Q/Q and 5 percent Y/Y.
Novocomms has secured £1.5 million of funding from Innovate U.K. (on behalf of the Department for Science, Innovation and Technology) to develop novel switch solutions that will deliver ultra-high speed wireless access.
Revenue for Rohde & Schwarz rose by 7.8 percent to EUR 3.16 billion, exceeding the three-billion-euro mark for the first time in the group's history.
At the Forum Innovation Défense (FID), Greenerwave showcased, alongside the French Defence Procurement Agency (DGA) and the French Defence Innovation Agency (AID), the major advances achieved within the m3SFA program, selected as one of the success stories of the 2025 edition.
Peraso Inc. announced a collaboration with Virewirx Inc. to provide its 60 GHz Perspectus™ modules to power the Virewirx VX60 platform.
COMSOL announced the release of COMSOL Multiphysics® version 6.4, which introduces new features, major performance improvements and expanded capabilities for multiphysics modeling and simulation app development.
Yole Group announced the release of its new technology and market report, Glass Materials for Semiconductor Manufacturing 2025, a comprehensive study analyzing the rapid rise of glass as a strategic material in semiconductor processes and permanent device architectures.
Würth Elektronik expands its range of FeatherWing development boards to include the Daphnis-I FeatherWing Board.
Quantic PMI has earned the ISO 9001:2015 and AS9100D certifications for its quality management system for its Frederick, Md., and El Dorado Hills, Calif., facilities.
Sivers Semiconductors announced a new collaboration with Doosan Corporation to develop scalable electronically steerable array (ESA) panels in the Ka-Band for satellite communications.
ZTE Corporation and MTN South Africa, have announced three major innovations that will transform network performance and customer experience.
congatec announced a technology collaboration with Qualcomm Technologies, Inc. that will speed the commercialization of high performance embedded edge AI applications for SWaP constrained industrial products based on Qualcomm Dragonwing™ processors.
Mini-Circuits CEO Jin Bains will deliver a plenary talk titled, “The Coming Wave of RF & Microwave Systems: Communication, Sensing, Energy & Beyond,” that will explore emerging applications that are redefining how RF and microwave technologies influence life on Earth and in space.
MatrixSpace is the winner in the U.S. Army’s xTechCounter Strike competition, part of Operation Flytrap 4.5.
.pf0{}The latest Ericsson Mobility Report – November 2025 reveals how the convergence of AI, cloud computing and mobile technologies are set to reshape data traffic patterns and connectivity demands.
United Monolithic Semiconductors (UMS) announced that it has secured a four-year contract from the Banque Publique d'Investissement (BPI) aimed at accelerating the development of cutting-edge solutions for advanced 5G communication systems.
Modelithics® announced the release of the latest version, v25.7, of the Modelithics COMPLETE Library™ for the Cadence® AWR Design Environment Platform.
Taoglas has introduced new enhancements to its Antenna Integrator tool – part of the company’s AntennaXpert suite – adding greater design flexibility and collaboration features for engineers developing next-generation connected and IoT devices.