Microwave Journal Magazine

HENSOLDT is equipping air defence systems from Rheinmetall subsidiary Rheinmetall Air Defence AG with radars from its SPEXER 2000 product family.

Defense Innovation Unit (DIU) announced top-performing solutions for the counter-small unmanned aircraft system (C-sUAS) low-cost sensing (LCS) challenge, with MatrixSpace Inc. selected as the overall winner and will receive the top award of $500k.

The global wireless industry continued its rapid expansion in the third quarter of 2025, with global 5G connections reaching 2.8 billion worldwide, according to data from Omdia and 5G Americas. 

Pico Technology announced the release of PicoScope 7 Software version 7.2.

Keysight Technologies, Inc. announced that in collaboration with KT SAT, it has demonstrated a successful non-terrestrial network (NTN) handover using the KOREASAT-6A satellite at the KT SAT’s Geumsan Satellite Center in Korea.

Indium Corporation announced the global availability of SiPaste® C312HF, a halogen-free, cleanable solder paste formulated for fine-feature printing. 

Sivers Semiconductors AB announced it has been awarded a new development program by the European Space Agency (ESA). 

Amphenol RF announced the introduction of a line of PFAS-free SMA connectors and adapters, expanding their portfolio of high performance RF interconnect solutions. 

The Wireless Broadband Alliance (WBA) published the “WBA Industry Report 2026,” which contains the results of its annual industry survey across the Wi-Fi, cellular and enterprise ecosystem. 

United Microelectronics Corporation (UMC) has announced a licensing agreement with imec for the transfer of imec’s iSiPP300 silicon photonics process, featuring co-packaged optics (CPO) compatibility, to accelerate UMC’s silicon photonics roadmap. 

CEA-Leti and STMicroelectronics presented results at IEDM 2025 showcasing key enablers for a new high performance and versatile RF Si platform cointegrating best-in-class active and passive devices used in RF and Optical FEM.

MatrixSpace announced the availability of its revolutionary Portable 360 Radar™.

With the new R&S NRP150T thermal power sensor, Rohde & Schwarz expands the frequency range of its R&S NRPxT series to 150 GHz.

Anritsu announced the launch of an advanced acoustic evaluation solution for next-generation automotive emergency call systems (NG eCall), developed in collaboration with HEAD acoustics.

Spacechips has introduced its AI1 transponder, a small on-board processor card containing an adaptive compute acceleration platform AI accelerator.

Kyocera and Rohde & Schwarz will showcase the characterization of Kyocera’s novel phased array antenna module (PAAM) at CES 2026 in Las Vegas, Nev. 

Richardson RFPD, Inc. now offers full design support and availability for two new high performance GaN RF power transistors from Guerrilla RF: the GRF0020 and GRF0030. 

HII announced that its Mission Technologies division has deployed and operationalized a next-generation high-performance spectrum dominance solution, now available for rapid detection and location of hostile communications, radar and other electronic threats.

Sivers Semiconductors AB announced a strategic partnership with DigiKey, expanding Siver's global access to its industry-leading mmWave products and evaluation kits (EVKs) for engineers, developers and customers worldwide.

Mercury Systems, Inc. will participate in this week’s Association of Old Crows (AOC) International Symposium and Convention, showcasing the company’s expanding portfolio of electronic warfare (EW) capabilities and sharing key insights during conference sessions.