Yole Group announced the release of its annual market and technology report, "Status of the Compound Semiconductor Industry 2026 – Focus on Substrates and Epiwafers," highlighting sustained structural growth through 2031.
Teledyne SP Devices’ ADQ35 offers a combination of speed, resolution and flexibility for demanding scientific, industrial and OEM applications.
Socionext and Innatera announced a jointly developed human-presence detection solution that combines 60 GHz FMCW radar sensing with neuromorphic edge AI to deliver reliable, always-on detection with drastically reduced power consumption.
Rohde & Schwarz, in collaboration with Broadcom, will display its CMX500 multi-technology multi-channel signaling tester at MWC Barcelona 2026 with newly added Wi-Fi 8 (IEEE 802.11bn) testing capabilities.
The Wireless Broadband Alliance (WBA) announced its new report, AI/ML for Wi-Fi: Enabling Scalable, Intelligent Wi-Fi Ecosystems.
Keysight Technologies, Inc. launched its next-generation Infiniium XR8 Real-Time oscilloscopes, designed to accelerate high speed digital and compliance testing while improving efficiency and insight for modern electronics development.
Teledyne HiRel Semiconductors announced the TDLNA0840EP, an ultra-low-power, wideband, low-noise amplifier (LNA) that delivers guaranteed operation to 4.0 GHz, while consuming only tens of milliwatts from a single 1.5 V supply.
Z-Communications, Inc. announced the launch of the CRO6000X2-LF C-Band oscillator.
AntennaWare has announced new products for sub-GHz and Wi-Fi 6E to complement their existing DECT, Bluetooth and UWB Bodywave™ antennas.
Rohde & Schwarz will showcase its upgraded one-box tester, CMX500, at MWC Barcelona 2026.
Smiths Interconnect will invest over £2 million into talent acquisition, automation, business development, manufacturing and testing at its Costa Rica facility to support the country’s growing electronics manufacturing sector and anticipate the growing needs of the aerospace, space and defence markets.
YINCAE Advanced Materials Co., Ltd. will exhibit at APEX 2026, March 17–19, at the Anaheim Convention Center in Anaheim, Calif.
At MWC Barcelona 2026, Yokowo and Yonezawa Bussan will jointly present a live V‑Band image‑transmission demonstration featuring the world’s first flexible waveguide, developed using Japan’s traditional kumihimo fiber‑braiding technique, combined with Yokowo’s dedicated compact connector system.
DesignCon has announced the keynote speakers for the 2026 edition.
Amphenol RF introduced new MMCX straight and right-angle plug cable assembly configurations designed on flexible RG-316 cable into their pre-configured cable assembly portfolio.
Ericsson announced a major joint Microsoft-Ericsson development in enterprise mobility — the integration of advanced 5G capabilities directly into Windows 11.
KRYTAR, Inc, announces a new two-way power divider offering high performance over the broadband frequency range of 7.0 to 24.0 GHz in a compact package.
Raytheon was awarded a contract from the Air Force Research Laboratory to develop a domestic production capability for thin film lithium niobate (TFLN) wafers, a material essential to high speed, secure communications and advanced sensing systems.
According to a recently published report from Dell’Oro Group, preliminary findings reveal that the RAN market ended the year on a stable note, with stronger than typical 3Q to 4Q seasonality.
Sivers Semiconductors AB announced general availability of its Cloudchaser beamforming chipset and Maverick antenna-array panels for Ka-Band satcom ground terminals.